Resin Transfer Molding (RTM) 370 Resin for High-Temperature Applications

This method produces a low density ablator similar to Phenolic Impregnated Carbon Ablator (PICA) using a cyanate ester and phthalonitrile resin system, rather than the heritage phenolic resin. Cyanate ester resin systems can be cured in a carbon matrix and generate high surface area structure within the carbon fibers. This helps to reduce the thermal conductivity of the material which is one of the key requirements of thermal protection system (TPS) materials. The material has densities ranging from 0.2 to .35 grams per cubic centimeter. NASA has successfully processed the cyanate ester and phthalonitrile resins with a morphology similar to that of the phenolic phase in PICA, but with more advanced properties such as high char stability, high char yield, and high thermal stability. This new generation of TPS materials has the same microstructure as heritage PICA, but improved characteristics of PICA such as increased char yield, increased char stability, increased thermal stability and increased glass transition temperature.

This unique approach modifies the phenolic polymer network by adding thermoplastic molecules with flexible segments such as aliphatic carbon and siloxane. The thermoplastic molecules are terminated with bifunctional groups that can directly react with the phenolic under the curing condition to form chemical bonds. Further incorporation of these segments can be facilitated by a relay reaction of a second molecular component which can bond with both the first flexible segments and the phenolic network. The selections of flexible, thermoplastic segments are based on desired properties, which include flexibility, ablative, an charring ability, heat resistance, and low catalycity. The modified phenolic is a truly molecular composite in which flexible segments are connected with the phenolic network through strong chemical bonds and are uniformly distributed among the networks. This feature renders a uniform toughening/strengthening effect without compromising the lightweight nature of the materials. The process is also feasible to scale up and amenable for manufacturing.

This NASA invention enables several benefits that mitigate limitations associated with conventional ATP systems, including the following: (1) avoids obtuse head rotation or cross-tool translation when laying adjunct tape plies, (2) simultaneously places tape on both sides of a part via two robots, (3) eliminates external anchoring frame requirements, and (4) translates parts during build while also translating the applicator head. The ability to perform simultaneous layup on opposite sides of the component, as well as reduction of head rotation reversal during bidirectional tape layup, offers increased layup speed. The invention offers increased placement accuracy as a result of reduced movement between tape layup operations and the eliminated need for an anchoring frame (facilitated by simultaneous pressure extrusion of prepreg by the two robots). NASA’s automated tow/tape placement system has two key unique features: the use of two opposed ATP cars to enable a tool-less process, and an on-the-fly reversal tape/tow laydown tooling head. The system uses two opposing (i.e., underside-to-underside) ATP cars, and can build parts vertically, horizontally, or at any other angle, depending on the workspace available. The ATP die wheels can be reversed or turned to draw the composite back and forth at different angles to create a layer-by-layer composite structure. Both cars can dispense TPC tape – thus, either car can function as an opposing tool surface while the other performs prepreg lay-up. For structures that do not vary in thickness, both cars can lay tape at the same time – doubling layup speed. Current ATP robots must rotate the large tooling head, or traverse panels without layering tape to achieve bidirectional layup, where each additional movement introduces alignment error. To increase layup rate while simultaneously minimizing misalignment, NASA’s system incorporates an on-the-fly reversal tape/tow laydown tooling head to enable efficient bidirectional layup.

NASA Glenn's durable, extreme-temperature, integrated circuit chips begin with the replacement of conventional silicon IC transistors with n-channel SiC junction field effect transistors (JFET) and resistors that can reliably function above 500°C. JFETs with the necessary high-temperature stability and electrical gain are fabricated from commercial 4H-SiC wafers with epilayers using dry etching and a self-aligned n-type ion implantation. An innovative circuit approach creates digital logic gates from these normally-on n-channel JFETs and resistors. Using two levels of 500°C durable metal to interconnect numerous SiC gates, complex circuits enabling a variety of control, operation and sensing functions for intelligent systems in harsh environments can be implemented in physically small chips. The challenge of getting electrical signals to and from the chip in a harsh environment is overcome by the use of the iridium interfacial stack (IrIS) that acts simultaneously as a bond metal and diffusion barrier, and can be used on an ohmic contact to the SiC. Combined with Glenn-developed high-temperature durable ceramic chip packaging and harsh environment sensor technology, this revolutionary durable integrated circuit technology is game changing for harsh-environment applications of all types.

Puncture healing melt blends were developed by melt blending self-healing polymers with non self-healing polymeric materials. The self-healing polymeric materials consisted of Surlyn&#174 8940, Affinity&#8482 EG 8200 G, and poly(butadiene)-graft-poly(methyl acrylate-co-acrylonitrile) or Barex&#174 210 IN. The non-self-healing polymeric materials consisted of poly(ether ether ketone) (PEEK), LaRC phenyl ethynyl terminated imide 330 (LaRC PETI 330), and Raptor Resins Bismaleimide-1 (BMI-1). Puncture healing blends were also prepared with chopped glass and chopped carbon fibers. The overall goal was to develop a product with superior properties relative to either of the starting materials. The melt blends were prepared in varying compositions to optimize desired properties of the resulting matrix. Ballistic testing was conducted to determine the self-healing characteristics of several developmental polymers subjected to micrometeoroid type damage.